Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer tests for Show driver, logic, and memory gadget. MPI’s cantilever probes would be the corresponding response into the demands of fine pitch, tiny pad dimensions, high speed, considerably less cleansing, multi-DUT, superior pin depend, and extremely-low leakage specifications. With fantastic craftsmanship, ground breaking architecture and proven methodologies according to mechanical and electrical simulation/measurement final results, generating MPI the very best cantilever supplier around the globe.
FCB Probe Card
The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is actually a verified Answer for a number of semiconductor production checks from early engineering pilot-operates to substantial volume producing (HVM). FCB is prepared for unit requiring superior sign integrity probing (SI) and/or electrical power integrity probing (PI). Applications include slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the world’s most effective Total Price-of-possession (COO) for a variety of DUT applications.
EVS Probe Card
The EVS Probe Card can be an enhancement over the standard buckling beam probe card. Crucial features are better existing carrying potential (C.C.C.) and reduced well balanced Make contact with drive (BCF), and also overall MEMS-like features. EVS can easily meet up with the requirement of Innovative wafer probing. Precise alignment and exceptional planarity control are classified as the key variables contributing to secure Make contact with resistance. With its potential and overall performance, EVS Probe Card is a really perfect option for Superior probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to need for at any time finer pitch. It is actually designed for more compact Al pad, and is particularly ideal for tiny pitch application with peripheral and whole array sample. With specific alignment and much better planarity Management, Osprey can arrive at higher productivity by multi-DUT layout. The forming wire (FW) style needle made with MPI’s possess micro fabrication system not only provides high-top quality functionality and also will allow quick needle replacement and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which can be made for the demand of reduced force probing. Additionally, it comes with the ability to fulfill superior C.C.C. and superior pin counts software. The MEMS approach assures very steady needle qualities, and also the special composition style and design allows precise alignment and planarity Manage.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both more info today and for many generations to come.
https://www.mpi-corporation.com/probecard/